EnSilica PLC - Oxford, England-based computer chip maker - Receives £5 million ‘Contract for Innovation’ from the UK government’s Department for Science, Innovation & Technology following a competitive process. The commercial-off-the-shelf Capability Hardware Enhanced RISC Instructions compliant secure processor chip developed under the contract will target next-generation of quantum resilient applications. The contract will be phased over two stages. Stage one sees £1.5 million specification and prototype development to be completed by March 2026. Stage 2 sees £3.5 million verification, silicon implementation and productisation, concluding by March 2028. The contract will cover the direct cost of development from specification to productisation. The contract will be gated against a break clause subject to continuation of funding for stage 2.
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